March 20, 2007, IXYS company launched a low voltage high current use insulation package MOSFET, the voltage from 55V to 100V, there is a very low loss and low Rds (on), which is continuously enriched IXYS company for low voltage , one of the products of high-current power conversion applications.

The new high-current MOSFET uses a patented IXYS ISOPLUS packaging technology! This ISOPLUS i5-Pak package is characterized by high current MOSFET conduction losses and switching losses low, there is need for hard switching avalanche rating. This series uses ISOPLUS i5-Pak package integrates two high-current MOSFET MOSFET chip, high reliability, current handling capability tall insulated packaging products. The current capacity of the power of a conventional encapsulated discrete devices 75A are basically limited to the following, which is considerably lower than the current power capacity of the internal wafer. And IXYS's ISOPLUS i5-Pak package is designed to overcome this difficulty, it combines a very good insulation, heat capacity and high power cycling capability and so on. At the same time the flexibility to put the package in which different topologies. In this series of high-current MOSFET for example, the product has five pins. Integrates two MOSFET in parallel to two internal pin as an output linked, so that the package of current handling capability of up to 150A, far beyond the limits of current handling capability of traditional packaging!

IXYS ISOPLUS packages are all the direct brazing (DCB) technology for internal insulation (the technology is generally applied only to the power module), and has achieved UL certification. Wherein: IXTL2X240N055T, is the 55V, Rds (on) only 0.0044 ohms, Rth (jc) is only 1.0 k / w, IXTL2X18N10T 100V Rds (on) only 0.0074 ohms, Rth (jc) is only 1.0 k / w, of these products can electric cars, electric forklifts, electric motorcycles, golf carts high-power, low-voltage applications provide a unique cost-effective device solutions.